Tough Hybrid Electronics for Biomedical and Robotic Applications
Department of Biomedical Engineering
Location: Edwin A. Stevens Hall, Room 222
Speaker: Seiichi Takamatsu, Professor, School of Systems Science and Industrial Engineering, Binghamton University, State University of New York
Abstract
My research focuses on developing hybrid electronics (THE) with high mechanical strength and high reliability for biomedical and robotic applications. THE combines flexible organic electronics for sensors and wiring with traditional inorganic silicon chips for high-speed components, enabling biomedical and robotic applications previously unattainable with organic electronic devices. Although inorganic materials is rigid and britle and there is difficulty of making them soft, the inorganic material-based soft substrate and functional materials offers high mechanical strength and long term reliability. This talk will cover two key challenges in advancing FHE technology. First, I have developed a fabrication and assembly process to 5 micrometer ultrathin silicon chips, making them flexible, and used my precision assembly techniques to prototype a reliable VR hand motion capture and robotic system. Second, I have created high reliability wiring and device integration techniques on fabric substrates, demonstrated with a wearable ultrasonic probe. These advancements in technology have significant potential for biomedical and robotic applications.
Biography
Seiichi Takamatsu received his B.E., M.E., and Ph.D. degrees in mechanical informatics from The University of Tokyo, Japan, in 2003,2005, and 2009, respectively. He joined the National Institute of Advanced Industrial Science and Technology (AIST) in 2009, where he was a Researcher with the Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSME), AIST until 2016. He was an Associate Professor with The University of Tokyo between 2017 and 2024. He is currently a professor at Binghamton University, State University of New York since 2024. His research interests include hybrid electronics, wearable MEMS technologies, and meter-scale electronic textiles. He has published over 140 journal and conference papers on hybrid electronics and electronic textiles and has received the Excellent Researcher Award from the University of Tokyo, the Satomi Prize, and the Young investigator award of Japan Institute of Electronics Packaging.
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