Director: Dr. EH Yang 

Lab Staffs:

Postdoctoral Scholar
Dr. Kyungnam Kang (2013-current)
Ph.D. from Louisiana State University
Research: 2D materials
Postdoctoral Scholar
Dr. Minjie Wang (Summer 2017-current)
Ph.D. from Rice University
Research: Devices based on 2D materials

 

Equipment

The multi-user MicroDevice Laboratory (MDL) is housed within an 800 square feet clean room at Stevens Institute of Technology. The following pieces of equipment will be available within the facility: 

A complete lithography system including Mask Aligner (Karl Suss MA6), Nanoimprintor (Nanonex), Spin Coater/Drier (Headway Research), Solvent Bench (Clean Air Products), Wet Etch Bench (Clean Air Products), Laminar Hood, Hotplate System (Alpha Multiservices), Ovens (Alpha Multiservices), and Surface treatment (O2 plasma) are available.

For characterization, Environmental Scanning Electron Microscope (SEM, FEI), Atomic Force Microscope (AFM, Pacific Nanotechnology), and Small Angle X-ray Scattering (SAXS, Brucker Nanostar) are also available.

For deposition, Physical Vapor Deposition (PVD, Denton Vacuum), Thermal Evaporator (Ladd Research), Sputter Coater (Pelco), and Molecular Vapor Deposition (Applied MST) are installed. In addition, Deep Reactive Ion Etcher (DRIE, BMRTek), XeF2 Etcher (Xactix), and Inductively Coupled Plasma Etcher (ICP, BMRTek) are available along with other testing equipment such as Microscope (Nikon) and Probe Station (Signatone).

Lithography

  • Hot plate
  • Convection oven: Barnstead Lab-Line class 100 clean room oven
  • Spin coater: Headway Research PWM32-PS-R790
  • Mask aligner: Karl Suss Microtec MA6/BA6
  • Wet bench: Clean Air Products
  • Nanoimprintor: Nanonex NX-1000

Wet Etching

  • Wet bench: Clean Air Products

Dry Etching

  • XeF2 etcher: XACTIX Xetch e1
  • Deep reactive ion etcher (DRIE): BMR Technology DSE200 

Deposition

  • Thermal evaporator: LADD Research filament evaporator
  • Physical vapor deposition (PVD): Denton Vacuum Explorer 14 
  • Molecular vapor deposition (MVD): Applied MST
  • Deep Silicon Etcher
  • Inductively coupled plasma etcher (ICP): BMR Technology HiEtch ICP-etcher module 

Characterization

  • Microscope
  • Scanning electron microscope (SEM): Quanta FEG 450 (High Vac, Low Vac, ESEM modes)
  • Atomic force microscope (AFM): Pacific Nanotechnology (Agilent Technology) Nano-R2
  • Small angle X-ray scattering (SAXS): Bruker Nanostar
  • Probe station: Semiprobe Semiconductor characterization system: Keithley 4200

MDL Equipment Overview

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