Layer-by-Layer Assemblies Conference: Science and Technology

Layer-by-Layer (LbL) Assemblies: Science and Technology Conference 
Hoboken, NJ | June 23 - 25, 2014

The Layer-by-Layer (LbL) Assemblies: Science and Technology conference will engage researchers and industry members from around the world to discuss the latest fundamental and technological developments in the field of sequentially absorbed, LbL-processed thin film materials.

This conference will bring together leading scholars from the LbL field to share the latest technical information to stimulate new ideas and applications for LbL assemblies. Join us on June 23 - 25, 2014 at our 55-acre campus overlooking the New York City skyline to expand your knowledge of this fast moving field and leave with a deeper understanding to further research and application of this technology.

Online registration is now open. Abstract submission is closed. Please click here to download a copy of the conference flyer and share with colleagues. We look forward to the engaging discussions that will follow.

Gold Sponsor

     

Silver Sponsor

 

 

Conference Organizers:
Svetlana Sukhishvili (Stevens)
Michael Rubner (MIT)
 
Organizing Committee:
Kookheon Char
Seoul National University, South Korea
 
Andreas Fery
University of Bayreuth, Germany
 
Nicholas Kotov
University of Michigan, USA