Faculty Profile Page

Charles Cohn

ADJUNCT PROFESSOR
Phone: 973.696.4611
Email: ccohn@stevens.edu
School:  Schaefer School of Engineering & Science
Department:  Chemical Engineering & Materials Science / Mechanical Engineering
Program:  Materials Science / Chemical Engineering / Mechanical Engineering
Education
  • NJ Professional Engineering License, 1979
  • Columbia University, ME , 1965
  • Columbia University, MS, ME, 1962
  • Columbia University, BS, ME, 1961
Experience
  • Technical Consultant, Japan Circuit Industrial CO., Ltd., Toyota Aichi, Japan (2006-Present)
  • Senior Analyst, TechSearch International Inc., Austin, TX (2005-Present)
  • Snr. Electronic IC Packaging Technologist, Distinguished Member of Technical Staff, Agere systems, Allentown, PA (2001-2005)
  • Electronic IC Packaging Technologist, Member Technical Staff, Agere Systems, Allentown, PA (1982-2001)
  • Solar Energy System Designer, Alan Spector Architect, Hamburg, NJ (1979-1990)
  • Engineering Specialist, Singer Co., Wayne, NJ (1969-1982)
  • Project Engineer, Bendix Corp., Teterboro, NJ (1962-1969)
Professional Service
  • Member, Ameican Society of Mechanical Engineers (ASME) (1980-Present)
Honors & Awards
  • Keynote Speaker, Surface Mount Technology Association (SMTA) Conference, 2008
  • Keynote Speaker, Accelerated Stress Test and Reliability (ASTR) Workshop, 2007
  • Keynote Speaker, Burn-in Test Socket (BiTS) Conference, 2007
Selected Publications
Book Chapters
  1. Charles Cohn. (1996, 2000, & 2005). "Packaging and Interconnection of Integrated Circuits", Electronic Packaging and Interconnection Handbook 2nd, 3rd, & 4th Edition, Charles A. Harper, McGraw-Hill.
  2. Charles A. Harper. (2005). "Examples of Failure Modes Common in Organic IC Packages", Failure Free Integrated Circuit Packages, Charles Cohn, McGraw-Hill.
  3. Charles A. Harper. (2005). "Fundamentals of IC Package Technologies", Failure Free Integrated Circuit Packages, Charles Cohn, McGraw-Hill.
  4. Charles Cohn. (2004). "Development and Fabrication of IC Chips", Electronic Materials and Processes Handbook, 3rd Edition, Charles A. Harper, McGraw-Hill.
  5. Charles Cohn. (2002). "Development and Fabrication of IC Chips", Electronic Assembly Fabrication Handbook, Charles A. Harper, McGraw-Hill.
  6. Charles Cohn. (2002). "Packaging of IC Chips", Electronic Assembly Fabrication Handbook, Charles A. Harper, McGraw-Hill.
Courses
  • MT 595 Reliability and Failure of Solid State Devices
  • MT 528 Solar Energy: System Designs
  • MT 518 Solar Energy: Theory & Application
  • ME 511 Wind Energy-Theory & Application