Beijing Institute of Technology

Master's of Engineering in Applications of Microelectronics and Photonics in Modern Communications

Applications of Microelectronics and Photonics in Modern Communications (AMPMC) is a unique, interdisciplinary Master-level graduate program offered at Beijing Institute of Technology by Beijing Institute of Technology (BIT) and Stevens Institute of Technology (SIT) jointly.  It was created to meet the needs of students and industry in the areas of design, fabrication, integration, and applications of microelectronic and photonic devices for communications (both fiber optic communication and wireless communication) and information systems.

The program covers fundamentals as well as state-of-the-art industrial practices to provide the students and practicing engineers with the necessary knowledge and training to be competitive and excel in the exciting fields of optical and wireless communications, as well as in microelectronics and photonics.  It is designed for maximum flexibility - to accommodate the background and interests of the participants for a Master’s degree.
 

Program Requirements
To earn a Master’s degree in the AMPMC program, a student needs to complete 30 credits (ten courses).  Specifically, the student will complete the three common core courses in the AMPMC program.  In addition, the student will complete seven AMPMC electives (to be chosen from the list below).

Core Courses in AMPMC

AMPMC 507  Introduction to Microelectronics and Photonics
AMPMC 626  Optical Communication Systems
AMPMC 683  Wireless Systems Overview

Electives in AMPMC

AMPMC 503  Introduction to Solid State Physics
AMPMC 509  Waves and Optics
AMPMC 515  Photonics I
AMPMC 516  Photonics II
AMPMC 542  Electromagnetism
AMPMC 553  Quantum Mechanics and Engineering Applications
AMPMC 561  Solid State Electronics I
AMPMC 562  Solid State Electronics II
AMPMC 595  Reliability and Failure of Solid State Devices
AMPMC 596  Micro-Fabrication Techniques
AMPMC 651  Spread Spectrum and CDMA
AMPMC 678  Physics of Optical Communication Systems
AMPMC 685  Physical Design of Wireless Communication Systems
AMPMC 690  Introduction to VLSI and MEMS Design
 

Admission Requirements
Admission to the AMPMC Master’s degree program requires a Bachelor's degree in electrical engineering, or materials science and engineering, or applied/engineering physics, or physics.  Applicants with other degrees may be considered, provided there is evidence of relevant academic background or practical experiences.  Individual courses are also open to all interested students not in the AMPMC degree program.  Acceptance to the AMPMC program is contingent upon successful review of an applicant’s application by the participating departments of BIT and SIT.  Interested applicants should contact the corresponding program coordinator(s) for general admissions requirements.
 

Course Descriptions

AMPMC  503  Introduction to Solid State Physics
Description of simple physical models which account for electrical conductivity and thermal properties of solids.  It covers basic crystal lattice structure, X-ray diffraction, dispersion curves for phonons and electrons in reciprocal space, energy bands, Fermi surfaces, metals, insulators, semiconductors, superconductivity, and ferromagnetism.

AMPMC  507 Introduction to Microelectronics and Photonics
An overview of microelectronics and Photonics science and technology.  It provides the student who wishes to be engaged in design, fabrication, integration, and applications in these areas with the necessary knowledge of how the different aspects are interrelated.

AMPMC  509 Waves and Optics
The general study of field phenomena; scalar and vector fields and waves; dispersion, phase and group velocity; interference, diffraction and polarization; coherence and correlation; geometric and physical optics.

AMPMC  515  Photonics I
Discussions of basic optical systems, laser beam propagation, abberation theory, design and analysis of optical systems, imaging, MTF theory, optical manufacturing and testing, interferometry and spectrophotometry, opto-mechanical engineering, radiometry and radiation detectors.

AMPMC  516  Photonics II
Topics covered include: optical thin films and materials production methods, Maxwell’s equations in stratified media, Fresnel equations, polarization, ellipsometry, thin film design and analysis, thin films for fiber optics applications, signal and noise considerations, infrared optical systems.

AMPMC  542 Electromagnetism
Electrostatics; Coulomb-Gauss law; Poisson-Laplace equations; boundary value problems; image techniques, dielectric media; magnetostatics; multipole expansion, electromagnetic energy, electromagnetic induction, Maxwell’s equations, electromagnetic waves, waves in bounded regions, wave equations and retarded solutions, simple dipole antenna radiation theory, transformation law of electromagnetic fields.
 

AMPMC 553 Quantum Mechanics and Engineering Applications
This course is meant to serve as an introduction to formal quantum mechanics as well as to apply the basic formalism to several generic and important engineering applications.

AMPMC  561  Solid State Electronics I
Introduction to fundamentals of semiconductors and basic building blocks of semiconductor devices.  Topics covered include description of crystal structures and bonding; introduction to statistical description of electron gas; free-electron theory of metals; motion of electrons in periodic lattices-energy bands; Fermi levels; semiconductors and insulators; electrons and holes in semiconductors; impurity effects; generation and recombination; mobility and other electrical properties of semiconductors; thermal and optical properties; p-n junctions; metal-semiconductor contacts.

AMPMC  562  Solid State Electronics II
Introduction to operating principles, modeling, and fabrication of solid state devices for modern electronic and photonic system implementation.  Topics covered include charge carrier transport in semiconductors; diffusion and drift, injection and lifetime of carriers. Various state-of-the-art electronic, photonic, and microwave devices and integrated systems will be discussed.

AMPMC  595 Reliability and Failure of Solid State Devices
Treatment of the electrical, chemical, environmental, and mechanical driving forces that compromise the integrity and lead to the failure of devices.  Both chip and packaging level failures will be modeled and quantified statistically.  On the packaging level, thermal stresses, solder creep, fatigue and fracture, contact relaxation, corrosion and environmental degradation will be treated.  Additional topics include strategies to enhance reliability, the roles of defects, yield modeling, testing, and failure mode analysis.

AMPMC  596  Micro-Fabrication Techniques
Discussions of aspects of the technology of processing procedures involved in the fabrication of microelectronic devices and microelectromechanical systems (MEMS).  Topics with respect to IC fabrication include crystal growth, epitaxy, silicon oxide growth, impurity doping, ion implantation, photo and electron beam lithography, etching, sputtering, thin film metallization, passivation and packaging.  Students will also learn that MEMS are sensors and actuators that are designed using different areas of engineering disciplines and they are constructed using a microlithographically-based manufacturing process in conjunction with both semiconductor and micromachining microfabrication technologies.

AMPMC  626  Optical Communication Systems
Topics covered include components for and design of optical communication systems; propagation of optical signals in single mode and multimode optical fibers; optical sources and photodetectors; optical modulators and multiplexers; optical communication systems: coherent modulators, optical fiber amplifiers and repeaters, transcontinental and transoceanic optical telecommunication system design; DWDM systems and components; optical fiber local area networks.

AMPMC  651 Spread Spectrum and CDMA
Basic concepts, models and techniques; direct sequence frequency hopping, time hopping, chirp and hybrid systems, jamming game, anti-jam systems, analysis of coherent and non-coherent systems; synchronization and demodulation; multiple access systems; ranging and tracking; pseudo-noise generators.

AMPMC  678 Physics of Optical Communication Systems
The physics behind modern optical communication systems and high data rate communication systems; information theory and light propagation in optical fiber wave guide channels; semiconductor laser sources and detectors; digital optical communication systems; quantum optical information theory; coherence and quantum correlations; optical solution-based communication; squeezed light and noise limitations; coherent optical communication systems; de-phasing and de-coherence; teleportation, cryptography, and fractal optics.

AMPMC  683 Wireless Systems Overview
An overview of the main themes impacting wireless communication systems. Recent, present and future generation wireless systems; cell-based systems; TDMA, FDMA, and CDMA approaches for wireless; mobile communications and system control; wireless LANs; wireless channels (multipath, fading, Doppler shifts, etc.); signal transmission in various physical environments (urban, rural, building); 3G digital wireless systems; principles of receiver and transmitter architectures; interference and noise effects; digital signal processing in wireless systems; contrasts between wireless and wireline communications for major applications.

AMPMC  685  Physical Design of Wireless Systems 
Introduction to wireless communication systems; the concept of frequency reuse; basic planning of a cellular system, elements of cellular radio design system; propagation characteristics of cellular radio channels; frequency management, channel allocation and handoff mechanisms; specifications of digital cellular systems in China, USA and Europe; spread spectrum cellular communications; elements of cordless communication systems.

AMPMC  690  Introduction to VLSI & MEMS Design
Introduction to the principles and design techniques of very large-scale integrated circuits (VLSI) and microelectronic & mechanical systems (MEMS).  Topics include: MOS transistor characteristics, DC analysis, resistance, capacitance models, transient analysis, propagation delay, power dissipation, CMOS logic design, transistor sizing, layout methodologies, clocking schemes, case studies. Silicon MEMS device layout and design methodology. Students will use VLSI  and MEMS CAD tools for layout and simulation.